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Water-Triggered Self-Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process.
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Low-melting metal thermal interface material for high-power package application.
JOURNAL OF THE KOREAN PHYSICAL SOCIETY.
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Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0 Ag–0.5 Cu ball grid array package.
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98,
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Self-Repairing and Energy-Harvesting Triboelectric Sensor for Tracking Limb Motion and Identifying Breathing Patterns.
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Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets.
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Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface-Finished Printed Circuit Board and Its Drop Impact Reliability.
ADVANCED ENGINEERING MATERIALS.
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Electronic textiles: New age of wearable technology for healthcare and fitness solutions.
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Recent progress of Ti3C2Tx-based MXenes for fabrication of multifunctional smart textiles.
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Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate.
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Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni joints with reflow time.
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Effects of the local microstructures on the mechanical properties in FSWed joints of a 7075-T6 Al alloy.
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High-temperature stability of Ni-Sn intermetallic joints for power device packaging.
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Effect of microstructural variation on the Cu/CK45 carbon steel friction weld joint.
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Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.
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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu-Ni bonding.
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Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior.
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Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn-58Bi.
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Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP).
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Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability.
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삼성북스.
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신소재공학.
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용접정밀접합.
원창출판사.
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주석-다층탄소나노튜브 복합체의 제조방법(METHOD FOR PREPARING SN―MWNT COMPOSITE).
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교류 전원 제어 장치 및 방법.
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Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP.
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UNITED STATES
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Enhancement of Ga-21.5 In-10 Sn Eutectic Alloy Based Thermal Interface Material Incorporating Cu Flake.
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UNITED STATES
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The Transient Liquid Phase Bonding by Ultrasonic-Assisted Soldering of Cu Contained Sn-58Bi Solder paste for High-Temperature Packaging Applications.
6th International Conference on Advanced Electromaterials.
KOREA, REPUBLIC OF
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Drop Properties of Wafer level Package Modules with Various Underfill Materials.
The 19th International Symposium on Microelectronics and Packaging.
KOREA, REPUBLIC OF
(2021)
Effect of EMI Shielding Fillers in EMC on RF Characterization in Range of 18GHz for Fan-out Package Structure.
The 19th International Symposium on Microelectronics and Packaging.
KOREA, REPUBLIC OF
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Evaluation of Bending Characteristics of WLP Module with Three Types of Underfill.
The 19th International Symposium on Microelectronics and Packaging.
KOREA, REPUBLIC OF
(2021)
Mechanical Reliability of Cu Core Solder Joints after Electromigration.
명 The 19th International Symposium on Microelectronics and Packaging.
KOREA, REPUBLIC OF
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Predicting the Mechanical, Creep Properties of BGA Solder Joints through Nanoindentaion.
The 19th International Symposium on Microelectronics and Packaging.
KOREA, REPUBLIC OF
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The Transient Liquid Phase Bonding by Ultrasonic-assisted Soldering of Cu Contained Sn-58Bi solder paste for High-temperature Packaging Applications.
The 19th International Symposium on Microelectronics and Packaging.
KOREA, REPUBLIC OF
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언더필 종류에 따른 WLP 모듈의 낙하충격특성 평가.
한국화학공학회 2021년도 가을 총회 및 국제 학술대회.
KOREA, REPUBLIC OF
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Fast formation of intermetallic compounds by transient liquid phase bonding with porous Cu for interconnection of power modules.
International Symposium on Innovation in Materials Processing 2021.
KOREA, REPUBLIC OF
(2021)
Low Temperature Transient Liquid Phase Bonding by using Eutectic In-48Sn Alloy for Cu-Ni Bonding.
International Union of Materials Research Societies - International Conference in Asia 2021.
KOREA, REPUBLIC OF
(2021)
Mechanical Properties and Microstructures of Cu/In-48Sn Alloy/Cu with Low Temperature TLP bonding.
International Union of Materials Research Societies - International Conference in Asia 2021.
KOREA, REPUBLIC OF
(2021)
Microstructural Evolution of In-48Sn Solder Joints with the Intense Pulsed Light Soldering Process.
International Union of Materials Research Societies - International Conference in Asia 2021.
KOREA, REPUBLIC OF
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Microstructure evolutions and mechanical properties of SAC305 with the intense pulsed light soldering process under high temperature storage test.
ECTC 2021.
UNITED STATES
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Cu hybrid paste의 IPL 저온 소결 및 특성 분석.
KMEPS 2021.
KOREA, REPUBLIC OF
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ENEPIG 표면처리에서의 레이저 솔더링 접합특성 평가.
KMEPS 2021.
KOREA, REPUBLIC OF
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다양한 전류밀도에서 SAC305/Sn58Bi BGA 구조 솔더 접합부의 전기적마이그레이션 거동.
KMEPS 2021.
KOREA, REPUBLIC OF
(2021)
에폭시 몰딩 컴파운드에 첨가한 Fe-3.5wt.%Si-4wt.%Cr 파우더 함량에 따른 차폐능 특성.
KMEPS 2021.
KOREA, REPUBLIC OF
(2021)
에폭시 몰딩 컴파운드의 방열필러에 따른 팬아웃 패키지의 뒤틀림 거동 및 방열특성.
KMEPS 2021.
KOREA, REPUBLIC OF